In Future Precision
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Semiconductor and electronics manufacturing technology
Industry application

Semiconductor & Electronics

Precision tooling and components for semiconductor packaging, lead frame processing, and PCB assembly jigs. We manufacture to the exacting tolerances demanded by IC packaging and semiconductor assembly equipment.

Semiconductor and electronics manufacturing needs stable tooling, controlled dimensions, and repeatable precision across small features. We support lead-frame, connector, jig, fixture, and packaging-related parts with CNC machining, wire EDM, sinker EDM, and finishing processes.

CNC machiningWire EDMSinker EDMProfile grindingCMM inspection

Industry requirements

  • Tight control on fine features, pitch, flatness, and repeatability.
  • Stable machining routes for carbide, tool steel, ceramics, and engineering plastics.
  • Clean finish and careful edge control for assembly and production equipment.

Typical applications

  • Lead-frame die inserts and trim/form tooling
  • Connector dies, carbide dies, and precision punch components
  • PCB assembly jigs, module fixtures, and semiconductor handling parts

Manufacturing advantages

  • Wire EDM and profile grinding support sharp profiles and hard material finishing.
  • CNC machining and sinker EDM combine for complex cavities and precision inserts.
  • Small-batch engineering changes can be absorbed without changing the full process chain.

Quality support

  • Dimensional checks are aligned to customer drawings and critical-to-function features.
  • ISO 9001:2015 workflow supports traceability through fabrication, inspection, and delivery.
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